Document zzjYG1MvJDpyyVeDvZ4GbR4pB

Annex to Question 2 Emission quantities are not fully known due to the lack of declaration/transparency regarding the quantities on PFAS used in products and materials, so that we limit ourselves to the use and the emission/disposal route. Sector E.2.10: Applications of fluorinated gases Subsector Refrigeration Use Central refrigeration system + plant-related, closed circuit Air conditioning and Air conditioning clean room, heat pumps closed circuit New Sub-use: dry etching of photomasks/reticles Etching processes Properties - Specific heat - Energy efficiency - High precision temperature control imparted by thermal stability - High precision temperature control imparted by thermal stability - Viscosity vs temperature characteristics - Specific heat - Electrical conductivity characteristics - Anisotrophic etching capabilities Waste/Emission Exchange only if required, withdrawal by manufacturer/service Refill if required, takeaway by manufacturer/service, only disposal of residual containers Are neutralized mainly via exhaust gas cleaning processes (combustion + wet scrubber) and then emitted to the air. Type of waste treatment Partly recycling, rest not known Not known n/a Page 1 of 4 Sector E.2.11.: Electronics and semiconductor Subsector Wires and cables Use Consumable Materials in semiconductor manufacturing support equipment (piping/tubing, replacement parts etc.) Coating, solvents and cleaning (including water based materials) Etching, coating, cleaning processes Properties - Inertness (no outgassing) - Chemical resistance - Mechanical stability - Purity - Low flammability - Temperature stability - Anisotrophic etching capabilities - Developing/developer capabilities electronic components Heat transfer fluids Consumable Materials in photomask/reticle and semiconductor manufacturing support equipment (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc.) Air conditioning clean room, closed loop - Inertness (no outgassing) - Chemical resistance - Mechanical stability - Low pressure drop (filters) - Low volatility/high stability - Purity - Low flammability - Temperature stability - Resistance to chemical permeation - High precision temperature control imparted by thermal stability - Viscosity vs. temperature characteristics - Specific heat - Electrical conductivity characteristics Waste/Emission Delivery to disposal companies Type of waste treatment Recycling Are neutralized mainly via exhaust gas cleaning processes (combustion + wet scrubber) and then emitted to the air. Delivery to disposal companies n/a Recycling (separation of the components) Refill if required, take-away by manufacturer/service, only disposal of residual containers Not known Page 2 of 4 Subsector Advanced semiconductor packaging Use Product protection box, specified by semiconductor industry Photolithography Surface coating Photolithography As both Lithographic protective film (pellicle / protective cover) membranes and AntiReflective (AR) coatings that are optically clear to specific wavelengths of light/radiation Properties - Temperature resistance - Product protection - Low off-gassing and particle generation - Electrical non-conductivity Uniformity in coating with minimal effect on properties provided by other critical resist/chemical ingredients (i.e., without impact to refractive indexes) - Low off-gassing and particle generation - Resistance to chemical permeation - Inertness - Optically clear to the wavelength of radiation/light used to print upon the customer's wafers. - Resistant to reflection that prevents the transfer of a clear image from the photomask/reticle to the wafer. Waste/Emission Remain at customer or delivery to disposal companies Liquid chemicals are collected, partially enters exhaust air, small amounts enters waste water Remains on product, when discarding/exchanging residual waste Type of waste treatment Recycling (processing into granules) Recycling (solvent waste is largely processed for the secondary market) Waste incineration Page 3 of 4 Subsector new Sub-use: tool parts & equipment Use Semiconductor and photomaskmaking manufacturing infrastructure (production and storage, high purity water manufacturing/delivery systems, high purity chemical & gas delivery systems, air filtration systems, bulk chemical delivery systems treatment and distribution, planar chemical delivery systems, liquid waste collection system, abatement systems, semiconductor wastewater treatment and HVAC including corrosive exhaust ducting and treatment, facilities systems controls, gaskets for pipelines, etc.) Properties - Inertness (no outgassing) - Chemical resistance - Mechanical stability - Low pressure drop (filters) - Low volatility/high stability - Purity - Low flammability - Temperature stability - Resistance to chemical permeation (safety requirements of chemical installations) Waste/Emission Substitute if required Type of waste treatment Not known Sector E.2.14.: Lubricants Subsector Lubricants, Greases Use - In clean room tools - semiconductor manufacturing infrastructure, e.g. oxygen plants or other installations, which require high standards on safety Properties - Inertness - Low off-gassing and particle generation - Resistance to chemical permeation (safety requirements of chemical installations) Waste/Emission Refill if required, take-away by manufacturer/service, disposal of (residual) containers and contaminated wipes Type of waste treatment Not known, probably waste incineration Page 4 of 4