Document xgrJGbGopDa1oRekQp9KGb0b

Supposed PFAS materials at Swissbit Germany AG: Line Material Ingredients 1 Chip adhesive Perfluoropolyoxyalkane ether~ 2 Die Adhesive Film (DAF) m-tolylidene diisocyanate silicon dioxide 3 Dam&Fill potting Siloxanes and Silicones, 3,3,3-methyl trifluoropropyl Usage Adhesive Adhesive Encapsulation 4 Mold compound 2,2'-((3,3',5,5'-Tetramethyl-(1,1'-biphenyl)-4,4'diyl)-bis(oxymethylen))bisoxiran 2,2'-(methylenebis((6-dimethyl-4,1phenylene)oxymethylene))bis oxirane Polycondensate of 4,4'bis(methoxymethyl)biphenyl and phenol Silica, vitreous Encapsulation 5 Flux Remover 6 Flux 7 Grease 8 Mold Release Film 9 Substrate (PCB) 10 Chip underfiller 11 Vacuum Oil Methyl-nonafluorbutylether (Methyl Nonafluorobutyl Ether) Methyl-nonafluorisobutylether (Methyl Nonafluoroisobutyl Ether) trans-dichloroethylene Dipotassium tetraborate tetrahydrate potassium fluoride potassium tetrafluoroborate silicon dioxide disodium sebacate Ethene, 1,1,2,2- tetrafluoro-, homopolymer ETFE no info Siloxanes and Silicones, 3,3,3-methyl trifluoropropyl 1-propene, 1,1,2,3,3,3-hexafluoro-, oxidized, polymd. Flux Flux Lubricant Mold Foil PCB Underfill Vacuuml Description Chip bonding Chip bonding Chip encapsulation material PFAS content confirmed supposed confirmed MAP Mold Material supposed PCB Repair supposed Flux for electr. Test construction work supposed Heat resistant grease for mold equipment Top Foil for Mold Release Package substrate Chip or package underfill Vacuum oil for plasma processing supposed supposed supposed confirmed supposed