Document wEGR6og49RGXJpNoxXpnR1X3

Annex A - Table A.49. Uses and properties of PFASs in the semiconductor industry identified by stakeholders - Updated since t Semiconductor Manufacturing Use Category Sub-Use Photolithography Photoacid generators Photolithography Antireflection coatings Photolithography Photolithography Topcoats and Embedded Immersion Barriers Layers Surfactants Photolithography Dielectric Polymers (PBO/PI) Photolithography Filters Nanoimprint Lithography Photoresist Epoxy, case masking Colour Filter photoresist for imaging semiconductor components "photopatterning" Plasma [Dry] Etch and Wafer Cleaning Vapour deposition chamber Cleaning Wet surface modification chemistries Wet etch (e.g. Wafer) Advanced Semiconductor Packaging Flux Development of necessary Semiconductor manufacturing - chemistries and their packaging to be process chemistries used for manufacturing of process recipes (Photo Acids, Polymer with Fluorine Groups, Monomers/prepolymers, Surfactants, Dyes etc.) The use of fluoropolymers in process chemistry manufacturing equipment (Filtration system e.g. PTFE filters, Pump, etc.), production infrastructure (Blending Kettles, Piping, Valves, etc.) and evaluation tools (coating, exposure and development tools, NMR, IR, ICP/MS, Titrator, etc.) Semiconductor manufacturing process chemistries The use of Consumable Materials for process chemistry development and manufacturing (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts, release film for mold process etc.) Semiconductor manufacturing Articles to store, handle, and deliver liquid process chemicals (Bottle Cap Seals, PTFE inner, PTFE tape, Dip tube, O-ring, Packing, Connector, Valve etc.) Semiconductor manufacturing MEMS wafer process Vapor HF Sacrificial Etch: Tool Parts, Seals, Fittings etc. Semiconductor Manufacturing Equipment (photolithography coaters, scanners and developers, dry etch, ion implant, deposition, CMP, assembly test, metrology, pumps, point of use abatement equipment, spare parts, equipment repair, maintenance of articles and mixtures used etc.) Semiconductor Manufacturing Equipment & Infrastructure Enabling Uses of Fluoropolymer Articles (raw materials including precursors, fluoropolymer parts embedded within manufacturing equipment, spare parts, equipment repair, maintenance of articles and infrastructure, filters, piping, tubing, gaskets, cables etc.) Data, Power & Fluid Delivery and Interconnects, sealants/piping, waste removal used in semiconductor manufacturing Plasma Etch and Wafer Cleaning Filters Ozone functionalized water Plasma Etch and Wafer Cleaning Thermal insulation for wet solution Wafer Heat Transfer Fluids Wet etch & clean filters Equipment Chillers Thermal Testing of Semiconductor Devices (in-line and end of line) Equipment Chillers Vacuum pump Vacuum fluid Plastics such as PC/ABS Fluoroelastomers, polymers including polyimides, polyamides, polyesters, polycarbonate etc. Adhesive, coating, lubricant Lubricants Semiconductor Manufacturing Equipment & Infrastructure - the design, manufacture and delivery of semiconductor manufacturing equipment Semiconductor manufacturing Reticle and pellicle manufacturing and all of its required chemicals, materials and tooling etc. Semiconductor manufacturing photolithography Consumable Materials in semiconductor manufacturing equipment (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc.) Semiconductor manufacturing Development of semiconductor manufacturing equipment (fluoropolymers, PFAS in mixtures etc.) Production of semiconductor manufacturing equipment The use of fluoropolymers and PFAS Production of semiconductor in mixtures in the production of manufacturing equipment semiconductor manufacturing Semiconductor Manufacturing infrastructure (production and storage, high purity water manufacturing/delivery systems, high purity chemical & gas delivery systems, air filtration systems, bulk chemical delivery systems treatment and distribution, planar chemical delivery systems, liquid waste collection system, abatement systems, semiconductor wastewater treatment and HVAC including corrosive exhaust ducting and treatment, facilities systems controls, gaskets for pipelines, etc.) Support of semiconductor manufacturing (Chemical transportation, air cleaning, waste removal, waste treatment, etc.) Plasma Etch and Wafer Cleaning Thermal insulation for gas supply and exhaust in Plasma Etch Vapour deposition chamber Thermal insulation for gas supply and exhaust in Plasma Etch Consumable Materials in semiconductor manufacturing infrastructure (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc.) Semiconductor manufacturing Development of semiconductor manufacturing infrastructure equipment (fluoropolymers, PFAS in mixtures etc.) Semiconductor manufacturing Support equipment for SM Processes Protection Equipment for Maintenance/Firefighting Semiconductor Manufacturing Support Equipment (Automated Material Handling Systems, lab equipment such as Die yield/Failure Analysis, Pathfinding/R&D, Chemical evaluation, associated abatement systems etc.) Support of semiconductor manufacturing Consumable Materials in semiconductor manufacturing support equipment (air and wet chemical filters, seals/o-rings, piping/ tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc) Semiconductor manufacturing Development of semiconductor manufacturing support equipment (fluoropolymers, PFAS in mixtures etc.) Semiconductor manufacturing Wafer processing and transportation FOUPs - Front Opening Unified semiconductor manufacturing Pod/Front Opening Universal Pod support systems - cassettes from front end to back end Advanced Semiconductor Packaging Encapsulants (epoxy underfills, mold compounds etc.) Advanced Semiconductor Packaging Thermal Interface Materials Advanced Semiconductor Packaging Adhesives Advanced Semiconductor Packaging Advanced Semiconductor Packaging Hydrophobic coating/hermetic seal packages Substrates including buildup/dielectric material Advanced Semiconductor Packaging MEMS anti-stiction layer/coating Advanced Semiconductor Packaging Advanced Semiconductor Packaging Die for chiplets Release sheet for thermocompression bonding process of semiconductor chips Advanced Semiconductor Packaging Advanced Semiconductor Packaging Packaging (bump, test, sort & assembly) Sintering of semiconductor chips to a heatsink Advanced Semiconductor Packaging Vapour phase soldering MEMS sensor packaging Passivation gels and coating materials MEMS sensor packaging Chemically robust adhesives for chip and package component attach MEMS sensor packaging Soft adhesives for chip attach MEMS sensor packaging Air-permeable membranes, protective meshes, and their hydrophobic and oleophobic coatings iconductor industry identified by stakeholders - Updated since the Call for Evidence/Royal Haskoning studies and initial uploads to the ECH Properties Examples of PFAS - Strong electronegativity of F atom in the Fluorinated salts complex resist/chemical matrix allows for controlled generation of strong acid upon exposure to UV light - Low dielectric constant - Low refractive index - Good thermal stability - Good barrier properties Acrylate and methacrylate-based copolymers - Hydrophobicity Fluoropolymers - Uniformity in coating with minimal effect Non-polymeric PFASs (non-ionic) on properties provided by other critical resist/chemical ingredients (i.e., without impact to refractive indexes) - Hydrophobicity - Electrical non-conductivity - Thermal resistance - Chemical resistance ' - Low extractables against solvents - Low surface adherence - Resistance to fire, grease, stain, etc. Water-insoluble C1 PFAS polymers Fluoropolymers Fluoropolymers Fluorotelomer-related compounds - Anisotrophic etching capabilities PFC, HFC and HFO gases Less shedding - Wetting agents - Selective metal oxide removal PFC, HFC and HFO gases Fluorinated organic acids - High-temperature thermal stability (>160 Surfactants C) High temperature stability up to 180C Low Young's modulus Low tensile strength (i.e. high stretchability with low tearing risk) Low adhesion strength Chemical inertness Fluoropolymer Chemical resistance to HF vapor, low particle generation Fluoropolymer - Chemical resistance - Low volatility/high stability - Thermal resistance - Cleanliness - UV resistance - Flame resistance - Inertness - Purity - Low flammability - Temperature stability - Resistance to chemical permeation - Low coefficient of friction - Optical properties - Low dielectric constant - Low dissipation factor - low outgassing factor - Stable electrical performance over high temperature Fluoropolymers (i.e., Teflon TM, Viton TM, PTFE, PFA, FEP, ETFE, PVDF, FFKM, etc) Chemical resistance Thermal durability High retention and high flow Low extractables Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Fluoropolymers Fluoropolymers Chemical resistance Temperature resistance Low extractables - High precision temperature control imparted by thermal stability - Viscosity vs temperature characteristics - Specific heat - Electrical conductivity characteristics Fluoropolymers Hydrofluoroethers, perfluoropolyethers (including PFPMIE), and other fully fluorinated liquids (perfluorinated amines and perfluoroalkylmorpholines, PFPE, Butane, 1-ethoxy-1,1,2,2,3,3,4,4,4nonafluoro-, 2,3,3,4,4-pentafluoro-5-methoxy-2,5-bis[1,2,2,2tetrafluoro-1-(trifluoromethyl)ethyl]tetrahydrofuran, Perfluamine, 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl )-3-pentanone PFCs HFCs HFOs - High precision temperature control imparted by thermal stability - Viscosity vs temperature characteristics, - Specific heat and electrical nonconductivity characteristics - High boiling point - Low pour point - Non-flammability Hydrofluoroethers, perfluoropolyethers (including PFPMIE), and other fully fluorinated liquids (perfluorinated amines and perfluoroalkylmorpholines, Reaction mass of 1,1,2,2,3,3,4,4,4-nonafluoroN,Nbis(nonafluorobutyl)butan-1-amine and 1,1,2,2,3,3,4,4,4- nonafluoro-N-[1,1,2,3,3-hexafluoro-2-(trifluoromethyl)propyl]-N(1,1,2,2,3,3,4,4,4-nonafluorobutyl)butan-1-amine - Thermally stable - Non-flammable and insoluble in water, acids, bases and most organic solvents - Inertness - Low off-gassing and particle generation Fluorocarbon ether polymers of polyhexafluoropropylene oxide, - Flame retardancy Perfluoroalkane sulfonic acids (PFSA), their salts and esters - Cross linking agent for fluoroelastomers, Bisphenol AF and its salts monomer, high temperature composites and electronic materials Solvability Perfluoroalkylethers - Inertness - Low off-gassing and particle generation PFPE Fluorosilicone PCTFE PTFE - Chemical resistance - Low volatility/high stability - Thermal resistance - Cleanliness - UV resistance - Flame resistance - Inertness - Purity - Low flammability - Temperature stability - Resistance to chemical permeation - Low coefficient of friction - Optical properties Fluoropolymers (i.e., Teflon TM, Viton TM, PTFE, PFA, FEP, ETFE, PVDF, FFKM, etc) - Inertness (no outgassing) - Chemical resistance - Mechanical stability - Low pressure drop (filters) - Low volatility/high stability - Purity - Low flammability - Temperature stability - Resistance to chemical permeation Fluoropolymers (PVDF, PTFE, etc.) Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Fluoropolymers Fluoropolymers Special requirements when F-containing VitonTM gloves, personal protective equipment for firefighters etc. gases come into play High airflow and low particle penetration Low outgassing Low particle emission Water spray washing resistance Fluoropolymers Temperature resistance Beneficial material flow Wetting, degassing and composite homogeneity Electrical non-conductivity Fluoropolymers High thermal conductivity/heat resistance Fluoropolymers Tear resistance High tensile strength Incorporation of various fillers into different resin systems - High-temperature thermal stability (>160 C) - Low surface tension - Solubility in organic solvents, low Fluorinated Tetracarboxylic acid anhydride derivatives, aromatic dielectric constants, and high thermal and diamines, acrylate and methacrylate-based copolymers thermo-oxidative stability - Unique hydrophobicity Fluoropolymers - High-temperature thermal stability (>160 Fluoropolymers C) - Electrical non-conductivity/low dielectric constant - Surface roughness/adhesion - Low coefficient of thermal expansion - Low coefficient of friction - Low surface energy - High thermal stability - chemical inertness - mechanical durability, - electrical insulation - low particle generation Fluoropolymers Fluoroalkyl Silanes - Heat-resistant - Releasability - Flexibility - Tensile strength - Anti-stiction - High thermal stability (>280C) - Contamination protection - Compensation of topology PTFE Fluoropolymers - High boiling point (>235C) PFPE - Long term thermal stability - No reactivity to semiconductor under these conditions Unique property: simultaneous high Fluoropolymers chemical stability against polar, unipolar and oxidative agents and acids Low Young's modulus that is constant over very wide operational temperature range (-50C to 175C) High thermal stability No significant aging over product lifetime (up to 15 years) Unique property: simultaneous high Fluoropolymers chemical stability against polar, unpolar and oxidative agents and acids Low Young's modulus that is constant over very wide operational temperature range (-50C to 175C) High thermal stability No significant ageing over product lifetime (up to 15 years) Intermediate Young's modulus that is constant over very wide operational temperature range (-50 to 175C) High thermal stability No significant aging over product lifetime (up to 15 years) Fluoropolymers Unique property: simultaneous high chemical stability against polar, unpolar and oxidative agents and acids Unique property: simultaneous hydrophobicity and oleophobicity High thermal stability up to reflow solder temperature (>260C) Fluoropolymers nitial uploads to the ECHA portal for the Annex XV public consultation Estimated Timeframe To Substitute with Non-PFAS Element Alternatives (Timeline commences after an invention is identified) 25+ years Process Chemistries 15-20+ years Process Chemistries 25+ years 15-20+ years Process Chemistries Process Chemistries 15-20+ years 15+ years 15-20+ years 15-20+ years Process Chemistries Semiconductor Device Process Chemistries Process Chemistries Process Chemistries Semiconductor Device 15+ years 10+ years 3-15+ years 5 years Process Chemistries Process Chemistries Process Chemistries Process Chemistries Process Chemistries at least 20+ years Process Chemistries Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Support Equipment Process Chemistries Process Chemistries Process Chemistries Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment 15+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure 8-14+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure 8-14+ years 10+ years 15+ years 15-20+ years 10+ years 10+ years 15+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment 15+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Not known Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor support equipment Semiconductor support equipment Semiconductor support equipment Semiconductor support equipment 13 years 20+ years 20+ years 10+ years 10+ years 15-20+ years 10+ years 10+ years Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Process Chemistries 15+ years 10+ years 10+ years 7+ years at least 20+ years Process Chemistries Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device