Document re6r64Vr7K159q8N04VQ6enNv

Dielectric Constant(DK)/er Thermosetting resin Thermoplastic resin Phenolic resin Epoxy resin PolyEtherSulfone BMI-based thermoset Polyimide BisPhenol-A Cyanate Speciality Cyanate PolyEtherimide PolyArylate PolyCarbonat Low Dk BT-resin PolyPhenylEther (PPE) PolyEthylene 0.0001 0.0010 0.0100 Dissipation Factor(DF)/tand 0.1000 Fig 1. Dielectric constant and Dissipation factor of the resins used for printed circuit boards R&D on alternative resins has been underway for the last several decades, but even today no alternative materials are available for use. Developing new materials that can replace PTFE with these unique properties is expected to be difficult, and this situation is unlikely to change for the foreseeable future.