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Lead Industries Association, Inc. ft* toiaft 292 Madison Avenue New York. N. Y. 10017 Telephone: (212) 679-6020 < /: February 6, 1975 SUBJECT: 4TH INTERNATIONAL AWS SOLDERING CONFERENCE - CLEVELAND, OHIO April 22-24, 1975 TO THE MEMBERS OF THE LEAD INDUSTRIES ASSOCIATION, INC.: We would like to call to your attention that the LIA is co-sponsoring the Fourth International AWS Soldering Conference being held at the Cleveland Convention Center, Cleveland, Ohio, April 22, 23, 24, 1975. Besides a series of formal presentations, there will also be two workshops in which individuals and organizations with questions about solder and the soldering process can discuss their problems with a panel of recognized experts. A full program and advance registration form for the Welding show and Conference is available upon request. Sincerely, JFS:Is Attachment Jerome F. Smith Secretary & General Manager LIA036S4 N 3752 I FOURTH INTERNATIONAL AWS SOLDERING CONFERENCE Co-Sponsored by Lead Industries Association, Inc. April 22, Tuesday Morning 9:30 A.M. to Noon S-l. ULTRASONIC SOLDERING Chairman, J. Terrill, Alcoa Paper "A" - "Ultrasonic Soldering - A Production Process of All Aluminum Coils" J. L. Schuster and R. J. Chilko, Alcoa Laboratories Paper "B" - "Fluxless Soldering Aluminum Air Conditioner Coils" W. B. Jenkins, Reynolds Metal Co. Paper "C" - "Large Magnetostructive Ultrasonic Soldering Pot for Fluxless Production Soldering" R. L. Hunicke, Lewis Corporation Paper "D" -"Ultrasonic Soldering of Joints" J. N. Antonevich, Blackstone Corp. Paper "E" - "Ultrasonic Soldering Equipment Used for Aluminum Heat Exchangers" C. A. Develow, Branson Sonic Power Co. April 22, Tuesday Afternoon 2:00 to 4:30 P.M. S-2. WORKSHOP: ADVANCED TECHNIQUES IN BRAZING AND SOLDERING (Joint workshop of Fourth International AWS Soldering Conference and Sixth International AWS-WRC Brazing Conference) J. R. Terrill, Chairman (Participants and topics to be announced) April 23, Wednesday Morning 9:30 A.M. to Noon S-3. DEVELOPMENTS IN SOLDERING MANUFACTURING TECHNOLOGY Chairman, W. G. Bader, Bell Telephone Laboratories Co-Chairman, K. Smalberg, American Smelting & Refining Company. Paper "A" - "Automated Paste Soldering Developments" J. J. McManus, Krohn, Inc. Paper "B" - "Evaluation of Post Soldering Flux Removal" Dr. J. Broos, Alpha Metals Li AC3685 N 3752.01 April 23, Wednesday Morning (Cont.) Paper "C" - "Forced Hot Air Reflow of Solder Plated Printed Circuits" A.M. Wittenbert, H. J. Schgnelle, F.J. D'Erchia, Bell Telephone Laboratories Paper "p" - "Automatic Soldering and Brazing" C. M. Norlin, Norbell Corp. April 23, Wednesday Afternoon 2:00 to 4:30 P.M. S-4. WORKSHOP: FILLER METALS AND SOLDERS (Joint Workshop of Fourth International AWS Soldering Conference and Sixth International AWS-WRC Brazing Conference) Chairman, R. Beal, IIT Research Institute Co-Chairman, R. L. Ray, Consultant (Participants and topics to be announced). April 24, Thursday Morning 9:30 A.M. to Noon S-5. NEW FLUX AND SOLDERING DEVELOPMENTS FROM RESEARCH Chairman, J. F. Smith, Lead Industries Association Co-Chairman, F. Barton, G. A. Avril Co. Paper "A" - "High Lead Solder Alloy for Radiators" R. Beal, IIT Research Institute Paper "B" - "Lead Alloys for High Temperature Soldering of Magnet Wires" W. Bader, Bell Telephone Laboratories Paper "C" - "Effect of Low Frequency Thermal Cycling on Solder Joints" R. E. Beal, E. R. Bangs, IIT Research Institute Paper "D" - "The Influence of Flux Substitute and Solder Composition on the Wetting of Solders" J. Shipley, IBM Corp. NOTE: FOURTH INTERNATIONAL SOLDERING CONFERENCE Cleveland Convention Center Cleveland, Ohio April 22, 23, 24, 1975 a