Document pLjY8V302nNa50Kbmm0pOwyB

Non-confidential attachment of PFAS public consultations PP-SFP-IPD-Aero 24/Aug/2023 Irradiated Products Division Sumitomo Electric Fine Polymer, Inc. Application of "Solder sleeve" (heat-shrinkable tubing with solder inside) for Aircraft harnesses installation This tint blue sleeve is PFAS(PVDF) before shrink after shrink Solder sleeve Comparison table of general characteristic of PFAS(PVDF) and its alternatives Materials PVDF EPDM Silicone PEEK Mica Polyvinyl Polyethylene Ceramic chloride Based Flexibility Continuous use temperature() Tensile strength(MPa) Tensile elongation(%) Flexural Modulus(MPa) Oil resistance Abrasion resistance Transparency Heat Shrinkable Tubing (Shrink ratio) Semi rigid 180 45 200 800 Excellent Excellent Excellent Possible (67%) Flexible 90 520 100800 5~10 Poor Poor Poor Possible (50%) Flexible 180 312 100500 5~10 Poor Poor Poor Possible (50%) Rigid 260 90 50 4000 Excellent Excellent Excellent Possible (40) Rigid 500(Mica) 0 10000 Excellent Excellent Poor Impossible Flexible Semi rigid 100 1550 500100 203000 Poor Good Good Possible (min.50%) Flexible Semi rigid 120 1030 5001000 202000 Good Good Good Possible (min.50%) Rigid 500 0 10000 Excellent Excellent Poor Impossible Comparison between PVDF, one of PFAS, and other alternative candidates. Gray shaded cells mean it has an issue, inferior than PVDF. As PVDF is 175 temp rating, the same or higher materials are silicone, PEEK, mica and ceramic. Mica and ceramic are inorganic material and cannot be processed into sleeve. Silicone and PEEK would be candidates of alternative, but they have following issues. Siliconenot transparent, thus cannot see the soldering status underneath PEEKcan be heat shrink tube, but the shrink ratio is up to 40% (solder sleeve requires min 67%) Therefore, they cannot be alternatives. Shrink ratio: (D-d)/D *100 (%) where as D: Inside diameter before shrink d: Inside diameter after shrink before shrink after shrink Why "solder sleeve" requires 67% shrink ratio? Here is our specification of solder sleeve in line with SAE AS83519. This spec tells why heat-shrink tube for solder sleeve requires high shrink ratio. It is because covered available wire size ranges (outside diameters). In case H-M-3, maximum Inside Diameter (ID) is D, 0.17 inch in Table 1. And the minimum ID of H-M-3 is D4, the minimum diameter of wire, 0.05 inch. This means the sleeve should shrink from 0.17 to 0.05, 70% shrink ratio. PEEK shrink tube cannot be used as its max ratio is only 40%.