Document nJx5X5XnYzjk04KrMXxpGK0z

Annex A - Table A.49. Uses and properties of PFASs in the semiconductor industry identified by stakeholders - Updated since the Call for Evidence/Royal Haskoning studies Semiconductor Manufacturing Use Category Sub-Use Properties Examples of PFAS Photolithography Photolithography Photolithography Photolithography Photolithography Photolithography Nanoimprint Lithography Photoresist Photoacid generators Antireflection coatings Topcoats and Embedded Immersion Barriers Layers Surfactants Dielectric Polymers (PBO/PI) Filters Epoxy, case masking - Strong electronegativity of F atom in the complex resist/chemical matrix allows for controlled generation of strong acid upon exposure to UV light - Low dielectric constant - Low refractive index - Good thermal stability - Good barrier properties - Hydrophobicity Fluorinated salts Acrylate and methacrylate-based copolymers Fluoropolymers - Uniformity in coating with minimal effect on properties provided by other critical resist/chemical ingredients (i.e., without impact to refractive indexes) - Hydrophobicity - Electrical non-conductivity - Thermal resistence - Chemical resistance ' - Low extractables against solvents - Low surface adherence - Resistance to fire, grease, stain, etc. Non-polymeric PFASs (non-ionic) Water-insoluable C1 PFAS polymers Fluoropolymers Fluoropolymers Fluorotelomer-related compounds Color Filter photoresist for imaging semiconductor components "photopatterning" Plasma [Dry] Etch and Wafer Cleaning - Anisotrophic etching capabilities PFC, HFC and HFO gases Vapour deposition chamber Wet surface modification chemistries (eg. Wafer) Advanced Semiconductor Packaging Cleaning Wet etch Flux Development of necessary chemistries and their packaging to be used for manufacturing of process recipes (Photo Acids, Polymer with Fluorine Groups, Monomers/prepolymers, Surfactants, Dyes etc.) Semiconductor manufacturing process chemistries Less shedding - Wetting agents - Selective metal oxide removal - High-temperature thermal stability (>160 C) PFC, HFC and HFO gases Fluorinated organic acids Surfactants The use of fluoropolymers in process chemistry manufacturing equipment (Filtration system e.g. PTFE filters, Pump, etc.), production infrastructure (Blending Kettles, Piping, Valves, etc.) and evaluation tools (coating, exposure and eevelopment tools, NMR, IR, ICP/MS, Titrator, etc.) Semiconductor manufacturing process chemistries Estimated Timeframe To Substitute with Non-PFAS Element Alternatives (Timeline commences after an invention is identified) 25+ years Process Chemistries 15-20+ years Process Chemistries 25+ years 15-20+ years Process Chemistries Process Chemistries 15-20+ years 15+ years 15-20+ years 15-20+ years Process Chemistries Semiconductor device Process Chemistries Process Chemistries Process Chemistries Semiconductor device 15+ years 10+ years 3-15+ years 5 years Process Chemistries Process Chemistries Process Chemistries Process Chemistries Process Chemistries Process Chemistries The use of Consumable Materials for process chemistry development and manufacturing (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts, release film for mold process etc.) Semiconductor manufacturing Articles to store, handle, and deliver Semiconductor manufacturing liquid process chemicals (Bottle Cap Seals, PTFE inner, PTFE tape, Dip tube, O-ring, Packing, Connector, Valve etc.) High temperature stability up to 180C Low Young's modulus Low tensile strength (i.e. high stretchability with low tearing risk) Low adhesion strength Chemical inertness Fluoropolymer MEMS wafer process Vapor HF Sacrificial Etch: Tool Parts, Seals, Fittings etc. Chemical resistance to HF vapor, low particle generation Fluoropolymer at least 20+ years Semiconductor Manufacturing Equipment (photolithography coaters, scanners and developers, dry etch, ion implant, deposition, CMP, assembly test, metrology, pumps, point of use abatement equipment, spare parts, equipment repair, maintenance of articles and mixtures used etc.) Semiconductor Manufacturing Data, Power & Fluid Delivery and Equipment & Infrastructure - Enabling Interconnects, sealants/piping, Uses of Fluoropolymer Articles (raw waste removal used in materials including precursors, semiconductor manufacturing fluoropolymer parts embedded within manufacturing equipment, spare parts, equipment repair, maintenance of articles and infrastructure, filters, piping, tubing, gaskets, cables etc.) - Chemical resistance - Low volatility/high stability - Thermal resistance - Cleanliness - UV resistance - Flame resistance - Inertness - Purity - Low flammability - Temperature stability - Resistence to chemical permeation - Low coefficient of friction - Optical properties - Low dielectric constant - Low dissipation factor - low outgassing factor - Stable electrical performance over high temperature Fluoropolymers (i.e., Teflon TM, Viton TM, PTFE, PFA, FEP, ETFE, PVDF, FFKM, etc) 15+ years Plasma Etch and Wafer Cleaning Plasma Etch and Wafer Cleaning Filters Ozone functionalized water Chemical resistance Thermal durability High retention and high flow Low extractables Thermal insulation for wet solution Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Fluoropolymers Fluoropolymers Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Support Equipment Process Chemistries Process Chemistries Process Chemistries Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Wafer Heat Transfer Fluids Wet etch & clean filters Equipment Chillers Chemical resistance Temperature resistance Low extractables - High precision temperature control imparted by thermal stability - Viscosity vs temperature characteristics - Specific heat - Electrical conductivity characteristics Fluoropolymers Hydrofluoroethers, perfluoropolyethers (including PFPMIE), and other fully fluorinated liquids (perfluorinated amines and perfluoroalkylmorpholines, PFPE, Butane, 1-ethoxy-1,1,2,2,3,3,4,4,4nonafluoro-, 2,3,3,4,4-pentafluoro-5-methoxy-2,5-bis[1,2,2,2tetrafluoro-1-(trifluoromethyl)ethyl]tetrahydrofuran, Perfluamine, 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl )-3-pentanone PFCs HFCs HFOs 8-14+ years Thermal Testing of Semiconductor Devices (in-line and end of line) Equipment Chillers - High precision temperature control imparted by thermal stability - Viscosity vs temperature characteristics, - Specific heat and electrical nonconductivity characteristics - High boiling point - Low pour point - Non-flammability Hydrofluoroethers, perfluoropolyethers (including PFPMIE), and other fully fluorinated liquids (perfluorinated amines and perfluoroalkylmorpholines, Reaction mass of 1,1,2,2,3,3,4,4,4-nonafluoroN,Nbis(nonafluorobutyl)butan-1-amine and 1,1,2,2,3,3,4,4,4nonafluoro-N-[1,1,2,3,3-hexafluoro-2-(trifluoromethyl)propyl]-N(1,1,2,2,3,3,4,4,4-nonafluorobutyl)butan-1-amine 8-14+ years Vacuum pump Vacuum fluid - Thermally stable - Non-flammable and insoluble in water, acids, bases and most organic solvents - Inertness - Low off-gassing and particle generation Fluorocarbon ether polymers of polyhexafluoropropylene oxide, 10+ years Plastics such as PC/ABS - Flame retardancy Perfluoroalkane sulfonic acids (PFSA), their salts and esters 15+ years Fluoroelastomers, polymers including polyimides, polyamides, polyesters, polycarbonate etc. - Cross linking agent for fluoroelastomers, monomer, high temperature composites and electronic materials Bisphenol AF and its salts 15-20+ years Adhesive, coating, lubricant Lubricants Semiconductor Manufacturing Equipment & Infrastructure - the design, manufacture and delivery of semiconductor manufacturing equipment Semiconductor manufacturing Reticle and pellicle manufacturing and Semiconductor manufacturing all of its required chemicals, materials photolithography and tooling etc. Solvability - Inertness - Low off-gassing and particle generation - Chemical resistance - Low volatility/high stability - Thermal resistance - Cleanliness - UV resistance - Flame resistance - Inertness - Purity - Low flammability - Temperature stability - Resistence to chemical permeation - Low coefficient of friction - Optical properties Perfluoroalkylethers PFPE Fluorosilicone PCTFE PTFE Fluoropolymers (i.e., Teflon TM, Viton TM, PTFE, PFA, FEP, ETFE, PVDF, FFKM, etc) 10+ years 10+ years 15+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Consumable Materials in semiconductor manufacturing equipment (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc.) Development of semiconductor manufacturing equipment (fluoropolymers, PFAS in mixtures etc.) Semiconductor manufacturing Production of semiconductor manufacturing equipment The use of fluoropolymers and PFAS in Production of semiconductor mixtures in the production of manufacturing equipment semiconductor manufacturing Semiconductor Manufacturing infrastructure (production and storage, high purity water manufacturing/delivery systems, high purity chemical & gas delivery systems, air filtration systems, bulk chemical delivery systems treatment and distribution, planar chemical delivery systems, liquid waste collection system, abatement systems, semiconductor wastewater treatment and HVAC including corrosive exhaust ducting and treatment, facilities systems controls, gaskets for pipelines, etc.) Support of semiconductor manufacturing (Chemical transportation, waste removal, waste treatment, etc.) - Inertness - Chemical resistence - Low volatily/high stability - Purity - Low flammability - Temperature stability - Resistence to chemical permeation Fluoropolymers (PVDF, PTFE, etc.) Plasma Etch and Wafer Cleaning Thermal insulation for gas supply and exhaust in Plasma Etch Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Vapour deposition chamber Consumable Materials in semiconductor manufacturing infrastructure (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc.) Thermal insulation for gas supply and exhaust in Plasma Etch Semiconductor manufacturing Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Fluoropolymers Fluoropolymers 15+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Development of semiconductor manufacturing infrastructure equipment (fluoropolymers, PFAS in mixtures etc.) Support equipment for SM Processes Semiconductor manufacturing Protection Equipment for Maintenance/Firefighting Semiconductor Manufacturing Support Equipment (Automated Material Handling Systems, lab equipment such as Die yield/Failure Analysis, Pathifinding/R&D, Chemical evaluation, associated abatement systems etc.) Support of semiconductor manufacturing Special requirements when F-containing gases come into play VitonTM gloves, personal protective equipment for firefighters etc. Not known Consumable Materials in Semiconductor manufacturing semiconductor manufacturing support equipment (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc) Development of semiconductor manufacturing support equipment (fluoropolymers, PFAS in mixtures etc.) Semiconductor manufacturing Wafer processing and transportation FOUPs - Front Opening Unified semiconductor manufacturing support Pod/Front Opening Universal Pod systems - cassettes from front end to back end High airflow and low particle penetration Low outgassing Low particle emission Water spray washing resistance Floropolymers Advanced Semiconductor Packaging Encapsulants (epoxy underfills, mold compounds etc.) Advanced Semiconductor Packaging Thermal Interface Materials Temperature resistance Beneficial material flow Wetting, degassing and composite homogeneity Electrical non-conductivity Fluoropolymers High thermal conductivity/heat resistence Tear resistence High tensile strength Incorporation of various fillers into different resin systems - High-temperature thermal stability (>160 C) - Low surface tension Fluoropolymers Advanced Semiconductor Packaging Adhesives Advanced Semiconductor Packaging Hydrophobic coating/hermetic seal packages - Solubility in organic solvents, low dielectric constants, and high thermal and thermo-oxidative stability - Unique hydrophobicity Fluorinated Tetracarboxylic acid anhydride derivatives, aromatic diamines, acrylate and methacrylate-based copolymers Fluoropolymers 13 years 20+ years 20+ years 10+ years Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor support equipment Semiconductor support equipment Semiconductor support equipment Semiconductor support equipment Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Advanced Semiconductor Packaging Advanced Semiconductor Packaging Substrates including buildup/dielectric material MEMS anti-stiction layer/coating - High-temperature thermal stability (>160 C) - Electrical non-conductivity/low dielectric constant - Surface roughness/adhesion - Low coefficient of thermal expansion - Low coefficient of friction - Low surface energy - High thermal stability - chemical inertness - mechanical durability, - electrical insulation - low particle generation Fluoropolymers Fluoropolymers Fluoroalkyl Silanes Advanced Semiconductor Packaging Advanced Semiconductor Packaging Die for chiplets Release sheet for thermocompression bonding process of semiconductor chips Advanced Semiconductor Packaging MEMS sensor packaging Packaging (bump, test, sort & assembly) Passivation gels and coating materials - Heat-resistant PTFE - Releasability - Flexibility - Tensile strength Unique property: simultaneous high chemical stability against polar, unpolar and oxidative agents and acids Low Young's modulus that is constant over very wide operational tempeature range (50..175C) High thermal stability No signifiant aging over product lifetime (up to 15 years) Fluoropolymers MEMS sensor packaging Chemically robust adhesives for chip and package component attach Unique property: simultaneous high chemical stability angainst polar, unpolar and oxidative agents and acids Low Young's modulus that is constant over very wide operational tempeature range (50..175C) High thermal stability No signifiant aging over product lifetime (up to 15 years) Fluoropolymers MEMS sensor packaging MEMS sensor packaging Soft adhesives for chip attach Air-permable membranes, protective meshes, and their hydrophobic and oleophobic coatings Intermediate Young's modulus that is constant over very wide operational tempeature range (-50..175C) High thermal stability No signifiant aging over product lifetime (up to 15 years) Unique property: simultaneous high chemical stability angainst polar, unpolar and oxidative agents and acids Unique property: simultaneous hydrophobicity and oleophobicity High termal stability up to reflow solder temperature (>260C) Fluoropolymers Fluoropolymers 10+ years 15-20+ years 10+ years 10+ years 10+ years 7+ years at least 20+ years Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device Semiconductor Device _