Document mB0RnK4epp6nerqEaKaOoo3Vb

Updated since the Call for Evidence/Royal Haskoning studies Semiconductor Man Use Category Photolithography Photolithography Photolithography Photolithography Photolithography Photolithography Nanoimprint Lithography Photoresist Color Filter photoresist for imaging semiconductor components "photopatterning" Plasma [Dry] Etch and Wafer Cleaning Vapour deposition chamber Wet surface modification chemistries (eg. Wafer) Advanced Semiconductor Packaging Development of necessary chemistries and their packaging to be used for manufacturing of process recipes (Photo Acids, Polymer with Fluorine Groups, Monomers/prepolymers, Surfactants, Dyes etc.) The use of fluoropolymers in process chemistry manufacturing equipment (Filtration system e.g. PTFE filters, Pump, etc.), production infrastructure (Blending Kettles, Piping, Valves, etc.) and evaluation tools (coating, exposure and eevelopment tools, NMR, IR, ICP/MS, Titrator, etc.) The use of Consumable Materials for process chemistry development and manufacturing (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts, release film for mold process etc.) Articles to store, handle, and deliver liquid process chemicals (Bottle Cap Seals, PTFE inner, PTFE tape, Dip tube, O-ring, Packing, Connector, Valve etc.) MEMS wafer process Semiconductor Manufacturing Equipment (photolithography coaters, scanners and developers, dry etch, ion implant, deposition, CMP, assembly test, metrology, pumps, point of use abatement equipment, spare parts, equipment repair, maintenance of articles and mixtures used etc.) Semiconductor Manufacturing Equipment & Infrastructure - Enabling Uses of Fluoropolymer Articles (raw materials including precursors, fluoropolymer parts embedded within manufacturing equipment, spare parts, equipment repair, maintenance of articles and infrastructure, filters, piping, tubing, gaskets, cables etc.) Plasma Etch and Wafer Cleaning Plasma Etch and Wafer Cleaning Wafer Heat Transfer Fluids Thermal Testing of Semiconductor Devices (in-line and end of line) Vacuum pump Plastics such as PC/ABS Fluoroelastomers, polymers including polyimides, polyamides, polyesters, polycarbonate etc. Adhesive, coating, lubricant Lubricants Semiconductor Manufacturing Equipment & Infrastructure - the design, manufacture and delivery of semiconductor manufacturing equipment Reticle and pellicle manufacturing and all of its required chemicals, materials and tooling etc. Consumable Materials in semiconductor manufacturing equipment (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc.) Development of semiconductor manufacturing equipment (fluoropolymers, PFAS in mixtures etc.) The use of fluoropolymers and PFAS in mixtures in the production of semiconductor manufacturing Semiconductor Manufacturing infrastructure (production and storage, high purity water manufacturing/delivery systems, high purity chemical & gas delivery systems, air filtration systems, bulk chemical delivery systems treatment and distribution, planar chemical delivery systems, liquid waste collection system, abatement systems, semiconductor wastewater treatment and HVAC including corrosive exhaust ducting and treatment, facilities systems controls, gaskets for pipelines, etc.) Plasma Etch and Wafer Cleaning Vapour deposition chamber Consumable Materials in semiconductor manufacturing infrastructure (air and wet chemical filters, seals/o-rings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc.) Development of semiconductor manufacturing infrastructure equipment (fluoropolymers, PFAS in mixtures etc.) Support equipment for SM Processes Semiconductor Manufacturing Support Equipment (Automated Material Handling Systems, lab equipment such as Die yield/Failure Analysis, Pathifinding/R&D, Chemical evaluation, associated abatement systems etc.) Consumable Materials in semiconductor manufacturing support equipment (air and wet chemical filters, seals/orings, piping/tubing, embedded lubricants (oils, greases, solids), non-process chemicals, replacement parts etc) Development of semiconductor manufacturing support equipment (fluoropolymers, PFAS in mixtures etc.) Wafer processing and transportation semiconductor manufacturing support systems - cassettes from front end to back end Advanced Semiconductor Packaging Advanced Semiconductor Packaging Advanced Semiconductor Packaging Advanced Semiconductor Packaging Advanced Semiconductor Packaging Advanced Semiconductor Packaging Advanced Semiconductor Packaging Advanced Semiconductor Packaging Advanced Semiconductor Packaging MEMS sensor packaging MEMS sensor packaging MEMS sensor packaging MEMS sensor packaging ing studies Semiconductor Manufacturing Sub-Use Properties Photoacid generators Antireflection coatings Topcoats and Embedded Immersion Barriers Layers Surfactants - Strong electronegativity of F atom in the complex resist/chemical matrix allows for controlled generation of strong acid upon exposure to UV light - Low dielectric constant - Low refractive index - Good thermal stability - Good barrier properties - Hydrophobicity - Uniformity in coating with minimal effect on properties provided by other critical resist/chemical ingredients (i.e., without impact to refractive indexes) Dielectric Polymers (PBO/PI) Filters Epoxy, case masking - Hydrophobicity - Electrical non-conductivity - Thermal resistence - Chemical resistance ' - Low extractables against solvents - Low surface adherence - Resistance to fire, grease, stain, etc. Cleaning Wet etch Flux - Anisotrophic etching capabilities Less shedding - Wetting agents - Selective metal oxide removal - High-temperature thermal stability (>160 C) Semiconductor manufacturing process chemistries Semiconductor manufacturing process chemistries Semiconductor manufacturing High temperature stability up to 180C Low Young's modulus Low tensile strength (i.e. high stretchability with low tearing risk) Low adhesion strength Chemical inertness Semiconductor manufacturing Vapor HF Sacrificial Etch: Tool Parts, Seals, Fittings etc. Chemical resistance to HF vapor, low particle generation Data, Power & Fluid Delivery and Interconnects, sealants/piping, waste removal used in semiconductor manufacturing - Chemical resistance - Low volatility/high stability - Thermal resistance - Cleanliness - UV resistance - Flame resistance - Inertness - Purity - Low flammability - Temperature stability - Resistence to chemical permeation - Low coefficient of friction - Optical properties - Low dielectric constant - Low dissipation factor - low outgassing factor - Stable electrical performance over high temperature Filters Ozone functionalized water Chemical resistance Thermal durability High retention and high flow Low extractables Thermal insulation for wet solution Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Wet etch & clean filters Chemical resistance Temperature resistance Low extractables Equipment Chillers - High precision temperature control imparted by thermal stability - Viscosity vs temperature characteristics - Specific heat - Electrical conductivity characteristics Equipment Chillers Vacuum fluid - High precision temperature control imparted by thermal stability - Viscosity vs temperature characteristics, - Specific heat and electrical nonconductivity characteristics - High boiling point - Low pour point - Non-flammability - Thermally stable - Non-flammable and insoluble in water, acids, bases and most organic solvents - Inertness - Low off-gassing and particle generation - Flame retardancy - Cross linking agent for fluoroelastomers, monomer, high temperature composites and electronic materials Solvability - Inertness - Low off-gassing and particle generation Semiconductor manufacturing - Chemical resistance - Low volatility/high stability - Thermal resistance - Cleanliness - UV resistance - Flame resistance - Inertness - Purity - Low flammability - Temperature stability - Resistence to chemical permeation - Low coefficient of friction - Optical properties Semiconductor manufacturing photolithography Semiconductor manufacturing Production of semiconductor manufacturing equipment Production of semiconductor manufacturing equipment Support of semiconductor manufacturing (Chemical transportation, waste removal, waste treatment, etc.) - Inertness - Chemical resistence - Low volatily/high stability - Purity - Low flammability - Temperature stability - Resistence to chemical permeation Thermal insulation for gas supply and exhaust in Plasma Etch Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Thermal insulation for gas supply and exhaust in Plasma Etch Low thermal conductivity Chemical resistance Thermal durability Less shedding Less gas Semiconductor manufacturing Semiconductor manufacturing Protection Equipment for Maintenance/Firefighting Support of semiconductor manufacturing Special requirements when F-containing gases come into play Semiconductor manufacturing Semiconductor manufacturing FOUPs - Front Opening Unified Pod/ High airflow and low particle penetration Front Opening Universal Pod Low outgassing Low particle emission Water spray washing resistance Encapsulants (epoxy underfills, mold compounds etc.) Temperature resistance Beneficial material flow Wetting, degassing and composite homogeneity Electrical non-conductivity Thermal Interface Materials High thermal conductivity/heat resistence Tear resistence High tensile strength Incorporation of various fillers into different resin systems - High-temperature thermal stability (>160 C) - Low surface tension Adhesives - Solubility in organic solvents, low dielectric constants, and high thermal and thermo-oxidative stability Hydrophobic coating/hermetic seal - Unique hydrophobicity packages Substrates including buildup/dielectric material - High-temperature thermal stability (>160 C) - Electrical non-conductivity/low dielectric constant - Surface roughness/adhesion - Low coefficient of thermal expansion MEMS anti-stiction layer/coating - Low coefficient of friction - Low surface energy - High thermal stability - chemical inertness - mechanical durability, - electrical insulation - low particle generation Die for chiplets Release sheet for thermocompression bonding process of semiconductor chips Packaging (bump, test, sort & assembly) Passivation gels and coating materials - Heat-resistant - Releasability - Flexibility - Tensile strength Unique property: simultaneous high chemical stability against polar, unpolar and oxidative agents and acids Low Young's modulus that is constant over very wide operational tempeature range (50..175C) High thermal stability No signifiant aging over product lifetime (up to 15 years) Chemically robust adhesives for chip and package component attach Unique property: simultaneous high chemical stability angainst polar, unpolar and oxidative agents and acids Low Young's modulus that is constant over very wide operational tempeature range (- 50..175C) High thermal stability No signifiant aging over product lifetime (up to 15 years) Soft adhesives for chip attach Intermediate Young's modulus that is constant over very wide operational tempeature range (-50..175C) High thermal stability No signifiant aging over product lifetime (up to 15 years) Air-permable membranes, protective meshes, and their hydrophobic and oleophobic coatings Unique property: simultaneous high chemical stability angainst polar, unpolar and oxidative agents and acids Unique property: simultaneous hydrophobicity and oleophobicity High termal stability up to reflow solder temperature (>260C) Examples of PFAS Fluorinated salts Acrylate and methacrylate-based copolymers Fluoropolymers Non-polymeric PFASs (non-ionic) Water-insoluable C1 PFAS polymers Fluoropolymers Fluoropolymers Fluorotelomer-related compounds PFC, HFC and HFO gases PFC, HFC and HFO gases Fluorinated organic acids Surfactants Fluoropolymer Fluoropolymer Fluoropolymers (i.e., Teflon TM, Viton TM, PTFE, PFA, FEP, ETFE, PVDF, FFKM, etc) Fluoropolymers Fluoropolymers Fluoropolymers Hydrofluoroethers, perfluoropolyethers (including PFPMIE), and other fully fluorinated liquids (perfluorinated amines and perfluoroalkylmorpholines, PFPE, Butane, 1-ethoxy1,1,2,2,3,3,4,4,4-nonafluoro-, 2,3,3,4,4-pentafluoro-5methoxy-2,5-bis[1,2,2,2-tetrafluoro-1(trifluoromethyl)ethyl]tetrahydrofuran, Perfluamine, 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl )-3pentanone PFCs HFCs HFOs Hydrofluoroethers, perfluoropolyethers (including PFPMIE), and other fully fluorinated liquids (perfluorinated amines and perfluoroalkylmorpholines, Reaction mass of 1,1,2,2,3,3,4,4,4-nonafluoroN,Nbis(nonafluorobutyl)butan-1-amine and 1,1,2,2,3,3,4,4,4-nonafluoro-N-[1,1,2,3,3-hexafluoro-2(trifluoromethyl)propyl]-N-(1,1,2,2,3,3,4,4,4nonafluorobutyl)butan-1-amine Fluorocarbon ether polymers of polyhexafluoropropylene oxide, Perfluoroalkane sulfonic acids (PFSA), their salts and esters Bisphenol AF and its salts Perfluoroalkylethers PFPE Fluorosilicone PCTFE PTFE Fluoropolymers (i.e., Teflon TM, Viton TM, PTFE, PFA, FEP, ETFE, PVDF, FFKM, etc) Fluoropolymers (PVDF, PTFE, etc.) Fluoropolymers Fluoropolymers VitonTM gloves, personal protective equipment for firefighters etc. Floropolymers Fluoropolymers Fluoropolymers Fluorinated Tetracarboxylic acid anhydride derivatives, aromatic diamines, acrylate and methacrylate-based copolymers Fluoropolymers Fluoropolymers Fluoropolymers Fluoroalkyl Silanes PTFE Fluoropolymers Fluoropolymers Fluoropolymers Fluoropolymers Estimated Timeframe To Substitute with Non-PFAS Alternatives (Timeline commences after an invention is identified) Element 25+ years Process Chemistries 15-20+ years Process Chemistries 25+ years 15-20+ years Process Chemistries Process Chemistries 15-20+ years 15+ years 15-20+ years 15-20+ years 15+ years 10+ years 3-15+ years 5 years Process Chemistries Semiconductor device Process Chemistries Process Chemistries Process Chemistries Semiconductor device Process Chemistries Process Chemistries Process Chemistries Process Chemistries Process Chemistries Process Chemistries at least 20+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Support Equipment Process Chemistries Process Chemistries Process Chemistries Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment 15+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment 8-14+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure 8-14+ years Semiconductor Manufacturing Equipment 10+ years 15+ years 15-20+ years 10+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment 10+ years 15+ years Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Equipment 15+ years Semiconductor Manufacturing Infrastructure Not known Semiconductor manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor Manufacturing Infrastructure Semiconductor support equipment 13 years 20+ years Semiconductor support equipment Semiconductor support equipment Semiconductor support equipment Semiconductor Device Semiconductor Device 20+ years 10+ years Semiconductor Device Semiconductor Device 10+ years 15-20+ years Semiconductor Device Semiconductor Device 10+ years 10+ years Semiconductor Device Semiconductor Device Semiconductor Device 10+ years Semiconductor Device 7+ years Semiconductor Device at least 20+ years Semiconductor Device