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ESIA submission to ECHA
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SIA
PFAS Applications in the
Semiconductor Industry
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Exceptional range of physiochemical properties of PFAS allows them to satisfy multiple and overlapping technical requirements for the industry.
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High chemical resistance to acidic, caustic and oxidative substances
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> Low degree of friction and abrasion
Special electrical properties for isolation and low k dielectric.
> Chemical purity, stability and compatibility
There are no scientifically known alternatives to PFAS for
most applications in the semiconductor industry.
sungonsngons
Snorgan shanti
CF (in CF-R1-R2)
CO (siele Bond)
GN (single Bond)
CC (in Ethane)
503 Ki/mol
358 /mol
305 kJ/mol
376 kJ/mol
ESIA
The restriction proposal from a
or
semiconductor perspective
----e--e--------------------------------------------,
+ PFAS shall not be not be manufactured, used or placed on the market
+ Potential derogation for the `semiconductor manufacturing process' until 13.5 years after EiF
Table A.49 in Annex A Uses and properties of PFAS in the
semiconductor industry identified by stakeholders
Table A.49 does not cover all PFAS uses in the semiconductor industry
+ Need for update
SIA
Updated Table A.49
I ------------------------------------------------------------------------------
+ Survey among ESIA and SEMI members to identify uses
+ Multiple iterations of new table
+ New table is very unlikely to be complete
* Results
+ Identified ca. 35 broad use categories
+ Placed them in the four application areas (see slide 2)
+ Explained the properties of PFAS required in those uses
+ Estimated timeframe to substitute after invention is identified
SIA
Questions?
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