Document emKR6JpebaMRB3oY9Z9dbx7G

Figure1 [Pellicle] [Pellicle cross section] Film A Adhesive B Frame Mask Adhesive Figure2 Pellicle Photomask Figure Lithography Light Source ArF (193nm) Front Processes Designoo oxidation CVD, spattering photoresist coat dry etching Semiconductor Process ion injection wiring Wafer Photomask with pellicle Back Processes molding bonding mounting wafer test dicing Figure4 Exposure Light (193nm) Photomask Lens Particle photo resist Wafer circuit failure Particle Pellicle Shift the focus position. No failure.