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August 3, 1571 a. UN F GRMJLA -53-. CHICAGO, ILLINOIS PL.'.XT FORMULA REGULAR ALL PURPOSE JOINT COMPOUND C-951 REGULAR TOPPING joint compound Euff Joint Compound for toping and finishing joints and spotting nailheacs. To be supplied provisionally as Regular All Purpose and/or Joint Compound when requested. Also to be supplied as Topping Joint corr.oound. Tunc ticn Yellow Oxide 2087 Pigmentation Vonicice 31Z Fungicide Co Igor. T Slip Agent Defoamer Ac nose- 25 j r2\R Thickr.er a29 Starch Adhesive Hcrr.ccc 257 Adhesive Asbestos 7RF9 Fiber Filler Mica poOH Anti-Cracking Agent -- iii3S i or. o Filler R.M. Soec. 139 126 - 196 170 - 9 11 13 Perc cut r- .05 .4-0 . .025 .30 5.00 1.00 4.50 10.00 78.625 10C.00C Lot/Batch 4.0 2.0 16.0 1.0 12.0 200.0 130.0 400.0 3115.03 r CO oci-iCc.ri.cns : Refer to Plant Test ing Procedure No. 32. Moriirvor. Minimum Av-e :*cce 63 i zi or. s Refer to Plant Testing Procedure No. 33. Uet mix shall be plastic and buttery working and free of grit or coarse nereides. l- p c i^icoz ions Refer to Plant Testing Procedure No. 33. After compound has dried, tape shall delaminate when Deeled back. There shall be, at most, only a couple of very small cracks in the wedge. opecittcatior.s Dried compound should be a neutral color and ...etch the standard samole. Stomp front of bag "Suff" SGP 0017131 March 30, 1972 Supersedes C-951 Dated 2/18/72 CHICAGO ILLINOIS PLANT FORMULA REGULAR ALL PURPOSE JOINT COUMPO'JND C-951 REGULAR TOPPING JOINT COMPOUND________ DESCRIPTION OF PRODUCT - Buff joint compound for taping and finishing joints and spotting nailheads. To be supplied 1provistonally as Regular All Purpose and/or Joint Compound when .requested. Also to be supplied as Topping Joint Compound. FORMULA Raw Material Function RtM.Soec. Percent L bs/Ba tch OOOOO Yellow Oxide 2087 Vanicide 51Z Calgon T Defoamer Mill Natrosol 250 HXR Staramic 747- Starch Kamaco 267 Asbestos 7RF9 Mica P80H Limestone Pigmenta tion Fungicide Slip agent Defoamer . Thickner Adhesive Adhesive Fiber Filler Anti-Cracking agent Filler 139 126 196 170 - - 9 11 13 .10 .05 .25 .025 .30 5.00 1.00 4.50 10.00 78.775 100.coo 4.0 2.0 10.0 1.0 12.0 200.0 40.0 180.0 400.0 3151.0 4000.0 WORKING CONSISTENCY Specifications - Refer to PlantTesting Procedure No. 32. . Maximum Minimum Aver 2e 64 62 63 WORKING PROPERTIES Specifications Refer to PlantTesting Procedure No. 33. Wet mix shall be plastic and buttery working and free.of grit or coarse particles. BONDING PROPERTIES Specifications CRACK RESISTANCE Specifications COLOR Specifications Refer to Plant Testing Procedure No. 35. After compound has dried, tape shall delaminate when peeled back. On every batch bonded tape should be wetted with a wet sponge, allowed to dry and exhibit at least a 707. bond. There shall be, at most, only a couple of very small cracks in the wedge. Dried compound should be a neutral color and match the standard sample. NOTE: Stamp front of bag ''Buff' -/ denotes change ED0:elz SGP 0017132 SGP 0017130