Document RpdwdzxVZxe1QmEjYjwjVoqDB
LIA23204
LEAD INDUSTRIES ASSOCIATION, In c .
3*1 HADIION AVINUI NtW YORK, N, Y. 1001?
TtLK AMO NI -- AH LA COOK Ilf OR I
January 20, 1965 SUBJECT; SUPPLEMENT TO
CERAMIC d at a bo o k
To Meobers of ths Lead Industries Association, Ino.t A press release on the latest supplement to LEAD IN THE CERAMIC
INDUSTRIES, along with a copy of the supplement, is enclosed. Bitltled Use of Lead in Solder Classes", thiu supplement explains the new deritrifyirg solder glasses and the role lead plays in their development and application. ' This suppleoent has been nailed to the 7,000 persons who now possess a copy of LEAD IN THE CIRAKIC D;DUSTRIES for insertion in the binder, and single copies will bo distributed in response to requests generated by the enclosed release and by publicity in Lead Magazine.
Information used to prepare the supplement was supplied by the Coming Class Vorks, or was gathered frea patent literature, and the staff written article was reviewed by the Ceramics Technical Conalttee prior to publication.
We feel that the suppleoent will be a useful addition to the ceramic data book while at the sane tine eerving as a good promotional piece f: " b7 keeping the subject of lead before members of the ceramic industry. V:
Very truly yours,
' tS': /a a t
Jerome P. Smith
JFS:df Enclosures
LIA23205
W^sWPIM A#***1
o NEWS From
Lead Industries Association, Inc
Bcsub-ur
292 Modison Aronv*
LookAh--dwtthlMd n w York, N. Y. 10017-OR 9-6020
RIUASIi Immediate (1/20/65) LIA Wi (12, 16)
Fwthw InformaHorn Jerome P. Salih
SUPFLEMEJfT CUT CM SOLDER CUSS SEA.LUO
"
0
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A new 4--page. lupplnMnt io LEAD IN Tfffi CKAKIC INIMSITUI*., Lhe ceramic data book publiabed by the Lead Industrie* Association, Inc*, baa Just been released.
Stable and deritrlfying solder glasses -- both high and low tee* perature -- are discussed froa the standpoint of composition differences and sealing characteristics. Advantages and liaitatiwia, selecting the proper glass, and completion of the seal are also explained. Three tables and two curves give a variety of typical compositions, electrical properties, expansion characteristics and permissible mismatch data.
Intended as a general primer for those wishing to learn noro on the subject, this piece supplements an existing section on solder glass and other glasses found in Section Four of LEAD IK THE CERAMIC INDUSTRIES. Both the supplement and the bock are available without charge froa the Lead Industries Association, Ir.c., 292 Kadison Avenus, IJew Tork City 10017.
TO THE EDITORt If you wish, you may have additional copies of this supple ment, or, if you have not yet received one, you are welcome to a copy of the ceramic data book, LEAD IK THE CERAMIC INDUSTRIES -- Just let us knew you'd like one.
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LIA23206
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SECTION 4
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USE OF LEAD IN SOLDER GLASSES*
I hfc are at prrH-ni t goneraI i\jw if x4shr glass the ihcMw*plaxtK \* stable ivpc. ansi the necf tlH-rnM*Miitng or devtirtfvmg t\ jv IN.- Liter mate rials tfK Lh h k v I j Ij and iVn tomrrtcsl i* vrvslaMirv idc'tfrihv*\fi ertamoss by subsequent beat Meatmen!.
WHY LEAD tS USED
t plays *jn mp.rtant rv4e in KmH i\|\v W glass.
Ihis i\ hcvau^ solder glasses containing Life
an*nintv W lead ovtdc have a km sWlening tem
perature. fssj ckvtfR'al prf\*ilH*v. aivd l*bO has a
minimum erttvt ik i thermal evpans*n In aJJiitsin.
Uad htlps t mj<nijin pKl durahiliiv *f (be (lavs
swiefi relative to tMhs-r km Irinjvraliire glasses. pa/-
iKiiLifh in lbs* area t mh *Mimc resrsiafvc Of
s*Hi(Ne. saber oviJos max he used in plasr W lead
|. athlete km lemfvfatiiie glasses. but ! ofUr (Ik *
same votlihlH'J halaiue of desirable
I w
in'ljtM'. all .dies nu\ lv Uh 'J ( vtfLn glasses. bill
wink- s** J.'ing thev ter*l l fa*sc evpan\s*n. kmcf
rkvlrisal rrsisiurve ami undermine ifurabilrtv.
STABLE SOLDER CLASSES
s.tnpK mh .s Ik iivujlv m i*k hvph leas! fe
e >*n **f (he svur. I'HMKI \l() S4I (often
K It t<
soils s J /!(*. stable *4 ttvMu-splastVs
s kt.-r pl.s*s.'s re ..Iso pi.On.t J fr.tp lht P?4> /-ill
H U svstei'' s-h k Ih ih s With small olOt*ofrs s4 Sit Vv I jt'lc 4* S'uh glasses have Iveti uses! Is * . ImmKl 4 W.ts l> h-it> salMHiv gla's ansi gljss-Usmctal assemblies c g v.lh.de (j \ hitw sc*k*d beam hcjillamps. eh the ah-hiv (till vmjs tkv srv.*sit\t .1 is-mpvr alures av km as 4<u < . seal tr anspafeneA. ,<k ! the tat that "pr* h*ms" rsl\. slashers discs, vis max K* utilized with this !\pe of v.'kk.t (lass
assure ils,toniinovs) trse f*r mam
DEVlTRirYING SOLDER GLASSES
I v pK alh. |Ik * ltH*fm*seUing *v dcsiUilvmp udder
glasses .ire lr**m lbs* iwicitt H'O M O
SiO .
often with \1 O *l f'llO atlJilii'iiN. *f In4h fal-k
4 lists tbs- n>mjvK(|ito if several Jeviinlvmp plasH*s
vilv*vl mi the p.itcnl lik-taltire v*veriMp v ik H vk*vek*p
iiK'iits HfaaJK. ibess- pljsses may be H*paraU\J nl*
In** sl.issilkati.His I (b.*M-
k* temperatuie veal-
mp I 17^ |.1 '(to < 1 vonljinmp 7( .V('< WaJ i\k Js*.
aiul. 2 hiyher lemperaltue flassev i^UI (* 7(KI C'l
v*olaMiiiif
l*W).
I Ik - ..ssisi.ruc if lb. H4*rr1 Oalt.*n artJ tMhers at the I Mining Iil.iss Weils. ( .rfmn/ Sc \>il. in the p<ep.1* of tho |\.prt is ptatefuMy askfKmWv'ped
375 TO 500*C DEVmurYING GLASSES
A nuntmum *M 70*. WaJ inkle h mcJ m ihe%e pljssev io assure that thi-v uiU iw<4 he kv rcfrasir> Kmjphtv r ii*. hH) is |hc upper lunif hecauve lar|er armnint tunJJ tervJ in raise -the (law evpatv vi*wt civrtK'ienf K*v**fvi the useful point fw sealmp nu* terials Hh an evpansam v*f I*A )(| jxt l it k*ss /nO. fhe itfver imp*nanf (lass n*Jifvr in ihrs pr.Hip. is UsuatK kept m ttur ? ' 14*. range * I vco lbm(h l sksrs i*4 eirtrt *ne erwiallme phase, it serves ti asl|t<4 the w v m\Ui4Ws 1 *Jevitiihcath*n pr\es' < 'HKentraintn. ol /nO pfealvr than 14*. icfnl It* asvektate vkvnnfkatKsn iv rap*Jh in ihe prewnse **l 1*141. hile m anKMinis U*>s than 7* . JesitrifKat.f> .xvttfs t*s vkmh at tbs* proptanvsl "seiiinj.up" litiipvtaHire
In vtnc eases h.mever. fcsilnrK.ton m.\ r*t K*
eviensivc r*t ts it aUaw Jt*siab|e that H K* vom-
pleu* Ihus, ib- ri*snhjni seal ru\ have a ratbs-r
lape p'assv phass- .a matftv. In ihe b(h leavl vie si
inis mp >*4kr plav^-s the vnstal phase n often a
kaj Kt.tc .t htivsiluate an.1 the mains busWr
IS a /in. ila.s With less fhait 7 . /t*,) it*- flass\
pt.ass- is l.s soft l.> pfoJlKc a slfsSlJ ths*1 mal 1C-
sisla'H si jl ^M*.Hnts i4 II O pre.iter than !<'. unJ
l ' It.aiv Pk p!as (4*0 slahk. lot,,kf`t>e t.4nijK>n
the .n.ii ,!i \ .-V-s* In
t ,- It <l
rf., .-s
Hi Uk K ait i o fluv. ansi soiKvo'tal-.-iis
Ltj-t ),.vv
s** that the ssalinf glass *il| n.a K f.x* soM.^ivc
V' .j af a*>r'>ina ate askkvl in aHwiinU |
|>
p* as mhthn.Tv of levHrifualh r> ..n,| to mipfose
res*tanee an1 s..fteno.- femps-faliifv-s
TABL5 4-5
$lobl. Sold.r OI<i6t.s Using L.oH
no
10. M
H), HO. uo
lrinil)l JmIm| To t .
! IP w BP r W`
too uo ITS no 71.1 47 71
10J 10J m 114 114 1121
404 1.5 0.511
11 M 111 14 2.1 M
11 11
114
104 14 0.5-10
W'C wc $79 C 440'C
S
N 1691.02
SECTION 4
FA4I Ut
LIA23207
TABU 4-4 D* vitrifyl/*g Sol<f*t Crict*i tiling L*od
no 1.0, 2tb
M, CaQ HA,
Mnciuti SmW W
r
r
' if p
w w ..
m 774 H4 774 715 174 U 74 U (4 104 U 1U U4 101 104 104 1U 114 K4 (U
24 IS 24 21 24 1U 114
uIS 14
24 U
j 5* C <50 C OO C 4'C 4SCC TM'C ttl`C
NJimv
.! w(vt nvvl.tms i'u\ K- -rul hj,r
Kxn ..iJ l. ch, c
ipttnurtU tn pl-KT iSc
PHI jrul /MU !* ,hjiifv sliplill, Ihv w j I .lur...
U'Ii'Ik a >JSr.hvt. .tIcn.-lh c\p.n...vi ov-lli.Aciit.
.K jrtpilmj vrjltrf uin|vf^ltllir\.
500 TO 700*C DCVlTRirYING GLASSES
11.-.- c '-.'-.-' j i.* t>.n.hL-t..h\ n..v,
f\ ihjn
*iv *:ipH lead
fUxxev anJ * haf j^lvf
h*ie |oer uv.'!u'nl' **i
o -.ij j 'K k> thjn
vi H pvf < i'i < * 1 \jmp!ex \ I a--! \ I!
n 1 .iMe 4 *i are txpiiji of thix !pv of
x*4,U-f p'axx Mcf`i *n /nit * -ei l.* a . 1k v
ohen v.-ntjin l< to
VO jnJ < to :
PM>.
.rv! seal il jf.*iirKf ?<* < A onjll aftnm'it ( uO ( ' t',, i *j h 1 to retard Jex tt ifualion and therein
u n Jik c the JiftifcfKc m thermal e\panx*n K.t*ccf lh<- p!ax afwJ lexjtrrfied 'tale .*1 the vIJu plaxx
loted in example Ml
Martin and /iinaf ha\c >c1 h*lh the foJl%Mnf *
iamags- it h ! ftaxxex
*.*klcr
ADVANTAGES
1. Clfcalef MplilX m hifh U mpetalufc apploc*! > | **f example, m waling i4*r l\ lace pafxU to ihf envelope. with Mh%e\piont cvhaUxt hake at oxer 4li0 ('
2. I*'*er expanw<*n |<f a p'nn waling lempofj* lure NVith xtahle xolJcf ptaxwv * lower eflectnc cxpjmu*n can *nlx he ohtairwJ at the vavfihvC ! mvfcascJ waling temperature*
.V Siren chafoi trnxliex max he m*'Tc ilexifahlc. In vync inxiaiwcx. it i\ pi*\xiMc to maintain eomptv*"ion xtrcxxex fri'ftt Haling temperature down to nnnn temperature.
4 | if \ttr>M~x Hithin the h*k`t lhe is Jirfef* I'lll;.<1 i.ntrai.tKn hetviveft the xealinp plaxx arxj K*0s"x Krinf xejtexl. ' IVOUX Jlxpt.u'OtlKT! e.m xsur Jnnnf Cix*?Ulp v\ik` IXntf ftwnp
4,,V.-r f'a'XA-x jfe either %ei up Junnf the e*^' ,v.W r w.iitijs.ti.vn ijilix in the vtunjMip
uy<. 'n -f often nK h 1*->x*,er. thus lilk't xir^xo.
arc 1- '*iX.
LIMITATIONS
t Vr'Svunt iVn* t,*r
wal fotnution ix
- .HtiiVA* luij to H.on Sn.f itwrvj' fi{ the
wa'.me temperaui.c will not help. \>fvc tVx
UxUa'ix Hmpx jh.-ut faMiT dex litilk ati.Mi
2 (tl^M vllTkjl
**ntro(
Pteflannp u ii alj\> p.\'hle. ar\J here it ;v ih t In rurroH r.npe cxtxtx hr e*nfx*fin;
4. The xeaU are jliu opjquc txheTcj' nith xtaMe fL>vrx ihe> nu\ he ttanxpjrent
SELECTING A SOLDER GLASS
llv reoutfomcnH fiv a p>xl e4Jit glasx arc lei* hut to utr\(t .
S-fii.no*- leo'pMjttirc well helow that x| ni-
vlex
anj 1iw enough n\H to at-
te\i heat mnMii\e cimifmrKnlx
A xrv.-*Mt W IP' to Hr pooex at Walm* lempetature
tA`K.L M.ttm (xteep xivcoNitx lemfxralure etirxx-i
An cxpanxH*n v*vtheient ax vhxe ax p>xxihle to |ty fhe*rriK)l> tvM x Iih * i within 2 * JO pet ( eonxnJcred a j ih w I malehl
AcxepljMe Jurahility in vefuee
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IVpcnJing UpsWl the application. Mbci pfOfVrtiex.
%iK'h s a rcasonahlx p*kl electrical resistance, might
he
Hui with high kad
this rrspufr*
incut is it'Mjlh easilx met. 1 he electrical properties
,*< a i i:aJ-alumino-horxilicate thermoplastic x*4Jcr
glax* ,,?e jiu'n in lahlc 4*7. Data *h > a 1 Icadallaln
silicate) glass the stem glass nv'sl used fr lamps
and radio tuKrs- arc gucn f*r comparison.
TABLE 4-7 EWctrical Properties of a
Solder Gloit
Ui 1 4 250'C Lot 1 if 350'C Nw Factor*
Dielectric Caratwt*
TVnn* plnlic Sotkr Qui
KM tit
cam 1U
Sta Ora
104 U 0.00 li u
* Ro m hnptrihrt, 1 c.
EXPANSION CONSIDERATIONS
l*f,*NiMv iht single mM important characteristic ol a solder glass in its expansion cvthcicnt. Ihi> i\ the as crape specific ehir.gation per degree Centigrade tr.Mii O I*' hat ('. ti ix approximately Imcjf until the vir,m point in approached and then it swings uj>Hal J.
IhiN iipH.dJ \wmg < **hcnd on iht1 expanshHi kiifu1 in ( v"*iNi*k*fahlc interest m scaling glass jp* ph*ali*tix because it i> here lh.it I he sir.im, anneal* mg ,mj setting tip points aft* loimd f i*r a soldcf glass this head will. **l course. occur at a lower tem perature than for the glass <v t.ihcr material to he vatod Ob\i*tisl\ then, a maUhing solder gl.i>s nitixf ha\o a lower c\panM.*n ovlliciont than the material t.i K* sealed in orJcr to base the Name contraction from setting-up point to rmm temperature. How much lower depend' on the setting-up point and on he shape of the solder glass curse.
I 'pure I shows a plM of the specific elongation. - I. | . '`(Mis the temperature f*T a lead hofosilicalc solder plass and the wslalime glass commonly lin'd |tr radn* tube en\elopes Ihcsc curies arc *hlamcd h) c.-ohn^ tU' pS-skv at I C per rnimitc from %taic 4
e^udihnum aNn* the anntahnp fk*mt. and ant t)pcal lor two fta'ses whkh. Iof most Wah, HOtUd he csnsklcfed a fod match.
Iherc u no unncrsal answer to the i^unUni W bow cUwe an expansion match is needed between a Milder (lass and the article to he sealed. Geometry <4 the article and the nature o( serskre expected miB he kiefnimin| factors, for an axerafe application, dif*
fereners %H * 2 10 r pet C <Hild he considered (s h *J. and differences up t* l(t 10 per <' arc
feasible. The permissible depjmire will increase ax one p*x-s to h*wcf lenijxtaltire fsoftett (lasses, since the seal then cools ihfisii(h a smaller leriipefatufe ranjtc alter wttinp up. fri(iirc - poo praphtc rep* resent^! hn f fkfmnsiHe mismatch ph'UeJ apainsl xetfinp temperature. It sh.ws ckaffi that cxpansi.xn n'atsh Can snK he ipmsted with xerx low tempera ture D.atefuls cp. sCahnp wax. etc.
viscosmr c o n s id e r a t io n s
\ iimvfiH' feature o< s**UVr plas>o is their h'w tens* fvraiufc flmdilx I h* tlimtiiv *r xiscisitx mvosarx to make *n\ pixen seal depends sn the tit K'lwo'n parts, the character the solder p'ass. anl the tuiw aXad.iMe t**r tfw ab With fv*hhed surfaces in intmute contact, seal* haxe K*en ntaJs' with \iNC.*>ito as hi(h as lu p`*so S4nk*tim.'s hiplvr llowexer. h ith a p-sf til f4*vjuifin( toniJcfabk* flow. \is c *s i* ties max hae t* K1 n ifw* ranpv of hi piis^-s r lower I he 11h rc f-.inf taupe. Jo to l<r |s im.% is the m.st ux-tul anJ peneralh resuhv in stronger seals.
I he ankHint of del`*tmatii*n that wilt . cctir in pnvo being piim'd depemh *n se'eral factiKs; |. pemw*tr\ *f the piece. 2 tK' cxti-rnal |of*c'. ' nature of
LIA23209
SECTION 4
fAM IMMT
the uippm. 4 Ihe duialKwi 4 heatm*. ami 5. **Uef
i-lass
An a yenefat j u k Ic , *hofc ihc hole
pnvc i' hcaed. ihc wlc upper limit iH he fr.m
near the annealing pmnt to perhaps* 4lt ( N"t
<icneralh. Ihc
point of the udder fla
\h.MiW he near Ihc annealing point of the article-
If local heating used. higher ntelting s.*IJef flassc*
can he eiuphncU.
t. -SeJmc ilh Vldcr Gla%" hy Robert M. Dalu*. /4 merit un Jtmrn.il ! /'*< w. J*. 47** I l%4|.
2 -t\>nJtKi*nc S'U'c* Glass CompositnifiO IV h Paunt - '.<**0.32*
J. "Sealing Glass.* l'. S Patent * J.0M.JJ3.
4. -Soil Glass and Composite Aitkk." L\ S. Paten* *
5 "Gla%%.tt*Ci1ass Seal 1. V Patent = 2.VM.I42.
f "I m Mclnnp Glass V-Ini and Article Made Thereftiim," l . S Paicnt - ?.I27.2*X.
7. "IV'iinlvinf SJdcr Glasv'r.S Palm! - 2.M*.*2.
t. ' I '.fcr:r.aV>> Sl.'Mtufijbk Glasses.- Hnth Patent * KM.kXt
#. "Therm .Ms IVv.it ifubk Sealing Glass." l* S Patent - \ ., MJ. i.tisx>VV
10. -PnifctiiCN anJ .\ppluatmis of fVsitrifwng S4de
Glasses hv f ijrwo U Marlin and I rani 7imr.
irimi fl< Pr.n n d/.n
the Sitth Stutp-ttimn *i
th, iit * (H.tttM.i* tr.; (
t
Ctv-Hl! C*-*-*4 &U w(t
S*a4t r*n --4*
4Ailf.| im>4*t fltuti W *
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