Document LJxqqe7pEo00Q83rwka8GaE05
LTENNECO, MATERIAL SAFETY DATA SHEET
i RcgliCtred U.5. TM of Tciuicco fnc,
(Approvedby US. Department of Labor as "essentially simitar" to FORM OSHA-20)
'NUMtft R
200
SECTION I IDENTIFICATION OF PRODUCT
MANUFACTURER'S NAME
TENNECO POLYMERS, INC., RESEARCH & DEVELOPMENT
ADDRESS
RIVER ROAD, F.O. BOX 129, FLEMINGTON, NEW JERSEY 08822
TRADE NAME AND SYNONYMS
TENNECO PVC COMPOUND, RIGID
CHEMICAL NAME AND SYNONYMS
POLY(VINYL CHLORIDE) COMPOUND
3780, 3782
chemical family
CHLOROHYDROCARBON POLYMER
MOLECULAR FORMULA
(CHjCHCl^
EMERGENCY TELEPHONE NO.
(609) 386-9200
MOL. WT.
SECTION II
COMPONENT *
HAZARDOUS COMPONENTS OF MIXTURES
THRESHOLD % LIMIT
VALUE
(UNITS)
COMPONENT
Tin Organic Compound Acrylic Resin
(0-3%) - 0.1 mg/m3 (0-2%) - 10 mg/m3 (ACGIH)
THRESMOLO % LIMIT ,
VALUE
(UNITS)
SECTION III PHYSICAL DATA
APPEARANCE ANO OOOR
White or colored pellets, practically odorless.
BOILING POINT (OEGREES FAHRENHEIT)
Not Applicable
VAPOR PRESSURE (MM. OF MERCURY)
Not Applicable
VAPOR DENSITY ~ (AIR - 1)
Not Applicable
SOLUBILITY IN WATER
Negligible
*
MELTING POINT (OEGREES FAHRENHEIT)
,,. .
Ot Applicable
Softens about 160 - 180F.
SPECIFIC GRAVITY (WATER 1)
1.32 - 1.42
PERCENT VOLATILE (BY WEIGHT)
Essentially non-volatile
EVAPORATION rate (Butyl ACETATE - 1)
Not Applicable
SECTION IV FIRE AND EXPLOSION HAZARD DATA
FLASH POINT (specify methoo) Ignition about 735F tPluto-ignitionea^out 850F (ASTM D-1929)
Flammable limits (PERCENT BY VOLUME)
FIRE EXTINGUISHING MEDIA
Water spray, carbon dioxide or dry chemical.
LOWER
UPPER
Not Applicable
LL FIRE-FIGHTING PROCEDURES
`'
Sater spray or f g may be helpful in reducing flame intensity and absorbing irritating
fumes. Shut off current in electrical equipment or wiring.
TEN 2280
UNUSUAL FIRE AND EXPLOSION HAZARDS
NFPA lists ignition temperature f 752*F for layer and 1220F for PVC dust cloud.
Produces combustible gases above 570*F. Fire conditions produce hydrogen pMnr<i) requiring prot ctive
SEC..ON V HEALTH HAZARD DATA
/
THRESHOLD limit value
See Section II
of OVEREXPOSURE
expected in normal handling. (Processing at high temperatures produces fumes irritating to eyes and respiratory tract, requiring local exhaust).
EMERGENCY AND FI AST AID PROCEDURES
Ordinary measures of personal hygiene. (See Section IX). (In case of exposure in hot processing, move to fresh air, flush eyes with water).
SECTION VI REACTIVITY DATA
tability
UNSTABLE STABLE
conditions to avoid jjormai processing temperature, about 350"F. causes slow darkening and decomposition. Higher X heat increases rate and evolution of HC1.
^COMPATIBILITY iMaimriolt to avoid/
None in ordinary use. Soluble in certain ketones and organic solvents.
aZARDOUS DECOMPOSITION PRODUCTS
Thermal decomposition prodiices
MAY OCCUR KZARDOUS
>LYMERIZATlON WILL NOT OCCUR
X
HC1. and CO and CO? (above
CONDITIONS to avoio
None in ordinary use.
570F).
SECTION VII SPILL OR LEAK PROCEDURES
E TAKEN IN CASE MATERIAL IS RELEASED OR SPILLED
up and remove to disposal container.
STE OtSPOSAL METHOD
lury in an approved landfill.
SECTION VIII SPECIAL PROTECTION INFORMATION /
PIRATORY PROTECTION (Specify type!
one required iif ordinary handling. See Section IX.
~
LOCAL EXHAUST
For hot processing.
MEFCoHrANoICrdALin(Gaernyeralh) andling.
reCTIVE GLOVES
.
.
itton gloves for hot processing.
SPECIAL
Vent to stack or scrubber.
Ventilate enclosed spaces.
EYE PROTECTION
Safety glasses.
sr protective equipment None required for ordinary handling. For hot processing local haust, safety glasses and gloves are recommended.
SECTION IX SPECIAL PRECAUTIONS
OSHAautions TO betaken IN handling AND storing standard 1910.1017 (.93q) on vinyl chloride
ts exposure to 1 ppm (8 hr. av.) and requires monitoring and other precautions in ag^flhandling and use of polyvinyl chloride, including labeling "Contains Vinyl ric^^~ Vinyl Chloride is a Cancel-Suspect Agent", excepting "Fabricated products" not
ict to "Mass Melting", as defined. New, low monomer content PVC compounds simplify ition below the OSHA 0.5 ppm Action leve and compliance, assuming normal conditions
ventilation in a processor's work area. Further developments on resins and
.ations are pending.
TEN 2281
. m* * * .
I NAME ANO TITLE