Document 0gj8qYkRxY70o4MEwovdrM2Om

E~ a TBaE p.Kooen rem mo Uses finewiretoconnectthesemiconductor wll Soneer Chipsarepackagedaspartofthewaferusing ol| u Fuere noise `substrate throughaninterposerlayer ofROL, siliconbridge,through-silicon via (TSV).orglass Fn * 208 --LL b-- HiEEmmmoetrmemm laterallyconnected,withorwithoutinterposers, es ER oo | Eono Wre. I o5 e |conor [OT .E TMes Tsv-HTITRNTD- Interposer ha .E =S50,(lion