Comments to the public consultation on the EU REACH restriction proposal on perand polyfluoroalkyl substances ("PFAS") made by Basell Sales & Marketing Company B.V.

JID: NF ELSEVIF ARTICLE IN PRESS Combustion and Flame 000 (2016) 1-11 Contents lists available at ScienceDirect Combustion and Flame journal homepage: www.elsevier.com/locate/combustflame m5 ;March 18, 2016;20:8 Combustion and Flame Understanding overpressure in the FAA aerosol can test by C3H2 F3Br (2-BTP) Gregory Thomas Linteris a'*, Valeri Ivan Babushoka, John Leonard Pagliaro , Donald Raymond Burgess, Jr. b, Jeffrey Alan Manion b, Fumiaki Takahashi'', Viswanath Reddy Kattad, Patrick Thomas Baker e a Fire Research Division, National Institute of Standards and Technology, Gaithersburg, MD 20899, USA b Chemical Sciences Division, National Institute of Standards and Technology, Gaithersburg, MD 20899, USA Case Western Reserve University, Cleveland, OH 44106, USA d Innovative Scientific Solutions Inc., Dayton, OH 45440, USA e The Boeing Company, Seattle, WA 98124, USA ARTICLE INFO Article history: Received 29 May 2015 Revised 14 October 2015 Accepted 15 October 2015 Available online xxx Keywords: Cs H2 F3 Br 2-BTP Cargo bay fire suppression Halon replacements CF3 Br, Clean agent fire suppression ABSTRACT Thermodynamic equilibrium calculations, as well as perfectly-stirred reactor (PSR) simulations with detailed reaction kinetics, are performed for a potential halon replacement, C3H2 F3Br (2-BTP, C3H2 F3Br, 2-Bromo3,3,3-trifluoropropene), to understand the reasons for the unexpected enhanced combustion rather than suppression in a mandated FAA test.

ELSEVIER Regulatory Toxicology and Pharmacology 134 (2022) 105226 Contents lists available at ScienceDirect Regulatory Toxicology and Pharmacology journal homepage: www.elsevier.com/locate/yrtph Grouping of PFAS for human health risk assessment: Findings from an independent panel of experts J.K.

Baile we as -- - x [natnlhmas icvdri BrinBfecm rb 1,1,1,2,3,3-hexafluoro-3-methoxy-2(trifluoromethyl)propane Cermber2107 Case Er -- | PBT assessment Administrative data PBT assessment: overall result f"rRoefmerence SoEwEeno a.

Comment on Proposed Restriction of PFAS Aug 24, 2023 Japan Valve Manufactures' Association (JVMA) Japan Valve Manufacturers Association (JVMA) appreciates the opportunity to provide comments to the PFAS restriction proposal. 1.

Initiating Search Substances: Filtered By: Number of Components: 2 SciFinder Page 1 Task History September 19, 2023, 11:04AM F3C SO2 N CF3 SO2 Search Tasks Structure Match: As Drawn Task Returned Substance Results + Filters (12,146) Exported: Retrieved Related Reference Results + Filters (4,660) Filtered By: Document Type: Search Within Results: Patent Ionic liquids Search Type Substances References View View Results View Results Copyright 2023 American Chemical Society (ACS).

Assogomma comments on the Annex XV Dossier of the universal PFAS restriction proposal September, 6th 2023 1 1.

ARTICLE pubs.acs.org/JPCA Atmospheric Chemistry of (Z)-CF3CHdCHCF3: OH Radical Reaction Rate Coefficient and Global Warming Potential Munkhbayar Baasandorj,, A.R.

Assogomma comments on the Annex XV Dossier of the universal PFAS restriction proposal September, 6th 2023 1 1.

GDCh Comments on the PFAS Restriction Proposal of ECHA Preamble With about 30,000 members, the German Chemical Society (Gesellschaft Deutscher Chemiker, GDCh) is one of the largest chemical societies worldwide.

PFAS-Containing Surfactants Used in Semiconductor Manufacturing Semiconductor PFAS Consortium Photolithography Working Group June 2, 2023 Acknowledgments: The PFAS Consortium would like to acknowledge the contributions of the Semiconductor PFAS Consortium Photolithography Technical Working Group for their efforts to compile this information.

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Figure1 [Pellicle] [Pellicle cross section] Film A Adhesive B Frame Mask Adhesive Figure2 Pellicle Photomask Figure Lithography Light Source ArF (193nm) Front Processes Designoo oxidation CVD, spattering photoresist coat dry etching Semiconductor Process ion injection wiring Wafer Photomask with pellicle Back Processes molding bonding mounting wafer test dicing Figure4 Exposure Light (193nm) Photomask Lens Particle photo resist Wafer circuit failure Particle Pellicle Shift the focus position.

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Processed Product for Food Contact Materials and Packaging Materials Application Number: Food contact materials and packaging materials (Annex E.2.3) Materials used in this product is PTFE (CAS NO: 9002-84-0), PFA (CAS NO: 2665500-5), and PVDF (CAS NO:24937-79-9).